Apple Inc. is reportedly collaborating with Broadcom Inc. to create a specialized server semiconductor tailored for artificial intelligence applications, according to a recent report by The Information.

Citing three sources with direct knowledge of the project, the report reveals that this advanced chip is expected to enter production by 2026. Notably, Apple plans to utilize the chip exclusively within its own operations, marking a strategic move to enhance its internal AI capabilities.

The initial design phase of the chip is slated for completion within the next 12 months. However, the subsequent revision and testing processes are anticipated to extend the development timeline by an additional year, underscoring the complexity and rigor of the project.