The European Commission has approved a €1.3 billion funding package to support the development of a groundbreaking semiconductor packaging facility in Novara, Italy. This ambitious project, led by Singapore-based Silicon Box, aims to revolutionize Europe's chip supply chain and enhance its technological autonomy.

Scheduled for completion by 2027, the €3.2 billion facility will feature cutting-edge panel-level packaging technology, representing a significant leap from traditional wafer-level packaging. This innovation, combined with 3D integration techniques, will enable advanced chip assembly, packaging, and testing processes.

Upon full operational capacity in 2033, the facility is expected to process approximately 10,000 panels per week, significantly boosting Europe's semiconductor capabilities and positioning the region as a global leader in chip technology.